The looming power and cooling challenge for data centres and liquid cooling solutions from Park Place Technologies
Date:
By: Paul Bevan
Classification: InContext
It goes without saying that advances in Information Technology (IT) have had a profound, and growing, impact on business over the last decade. The rise of AI, ML, and IoT has spurred the development of high-powered processors like GPUs and TPUs that consume more power and produce much more heat than previous generations of chips.
In this paper we will focus specifically on the cooling challenges that are resulting in traditional cooling solutions failing to keep up with hugely increased thermal demands, making liquid cooling an increasingly necessary solution. We will identify the various different types of liquid cooling with examples of the sort of use cases that best suit each liquid cooling approach and also highlight some of the non-technical challenges posed by their proposed adoption.
In the context of these challenges, we will highlight a new suite of services from Park Place Technologies and describe how, and how well, this meets the technical, implementation and ongoing support challenges of introducing new liquid cooling solutions while allowing companies to focus on developing and deploying new AI based applications without sacrificing environmental sustainability targets.